Healthcare Application Identification and Entrance Strategy for Quilt Packaging Technology

Student: Mark Roche, 2015-2016

Sponsor: Indiana Integrated Circuits, LLC , South Bend, IN

Quilt Packaging (QP) is a new integrated circuit packaging technology that enables advanced design by combining the highest-performance devices and materials into one monolithic device. Indiana Integrated Circuits (IIC) improves manufacturing yield for manufacturers of systems based on physically large chips (e.g. imaging arrays) and shortens design and test time for complex system-in-package devices through modular chip design. This thesis project identifies the ‘killer application’ for QP in the biomedical space. It provides a breakdown of how the technology will apply to healthcare, the market characteristics and competitors, costings for chip integration, and a strategy for revenue generation in this new market.