Market Identification and Approach for Optical Applications of Quilt Packaging

Student: L. Chardee Allee, 2015-2016

Sponsor: Indiana Integrated Circuits, LLC , South Bend, IN

As technology advances, there is a need for smaller, faster, and more efficient electronics. Quilt Packaging, a new chip interconnect and packaging technique, will allow for the development of high performance electronic devices by allowing for wide bandwidth data transmission, extremely accurate alignment, and low loss interconnect technologies between chips. With a wide array of applications, this project seeks to explore the use of Quilt Packing in the realm of optical applications which will allow for more efficient optical devices. This project will seek to determine appropriate optical applications for IIC expansion by providing an examination of the current markets and how Quilt Packaging can be successfully integrated for potential licensing agreements.